Place of Origin: | China |
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Brand Name: | Rvyuan |
Certification: | UL/SGS |
Model Number: | 0.025-0.60mm |
Minimum Order Quantity: | Different types with differet MOQ |
Price: | Negotiation |
Packaging Details: | Spool with carton |
Delivery Time: | 2-15 workding days |
Payment Terms: | Negotiation, L/C, T/T |
Supply Ability: | Satisfy your demand |
Conductor Thickness: | 0.05-0.60mm | Standard: | IEC/JIC/NEMA |
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Material: | Round Aluminum And Copper | Delivery: | Fast Delivery Gurantee |
Conductor: | High Purity Copper/CCA | Thermal Class: | 155-220 |
Insulation: | PEW/UEW/EIW/AIW | Bonding Way: | Hot Wind/solvent |
High Light: | self solderable copper wire,covered copper wire |
LOW DENSITY ULTRA FINE SELF BONDING WIRE COPPER MAGNET WIRE WITH HIGH PURITY COPPER EASY SOLDERING
A special type of enamelled wire is selfbonding wire or bondable wire. Selfbonding wire is an enamelled wire as described under Enamelled Wire Types, with an additional adhesive enamel overcoat. This adhesive has a bonding feature, which is activated by heat or solvents. Once activated the adhesive bonds turn to turn windings into a compact self supporting coil. The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications as bobbins, tape, varnishing, or impregnation may be eliminated.Self bonding wire not only include copper but also aluminum wire, the insulation type are PEW, UEW,EIW,AIW, thermal class from 155-220C.
FEATURES
Low density allows coil weight reduction. only 50% weight of copper at the same length
Easy soldering due to copper cladding
Higher conductivity compared to aluminum
APPLICATION
Copper Silver Alloy:HIgh end speaker coils, audio connection wire application. Silver Content:0.1-10%
Copper Zin Alloy: Gas nozzle, electro discharge machine, heating device. Zinc Content:10-30%
Copper Tin Alloy: Heating components application. Tin content:0.15%-6%
Copper Nickel Alloy: Heating components, resistance wire. Nickel content:2%-23%
SPECIFICATION
Self-bonding Enameled Wire |
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Description |
Designation |
Thermal Grade(℃) |
Diameter(mm) |
Feature |
Application |
Solvent Bonding |
Y1 |
130~180 |
0.01~0.5 |
Directly solderable |
Speaker coil(i.e.: microphone, |
Heat Bonding |
H |
130~180 |
0.01~0.5 |
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