| Place of Origin: | China |
|---|---|
| Brand Name: | Rvyuan |
| Model Number: | CLASS 180 0.02mm |
| Minimum Order Quantity: | Different types with differet MOQ |
| Price: | Negotiation |
| Packaging Details: | Spool with carton |
| Delivery Time: | 2-15 workding days |
| Payment Terms: | Negotiation, T/T, L/C |
| Supply Ability: | Satisfy your demand |
| Certification: | ISO9001/ISO14001 /UL/SGS | Color: | Nature/Red |
|---|---|---|---|
| Standard: | IEC/JIS/NEMA | Insulation: | Polyurethane |
| Diameter: | 0.02mm | Conductor: | Copper |
| Solderability: | Yes | OEM: | Support |
| High Light: | magnetic coil wire,self bonding magnet wire |
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COPPER MAGNET WIRE 0.02MM ULTRA FINE UEW WITH SOLDERABILITY
Class H is a thermal level which temperature is 180, that can meet most appplication in electronic industry. Here are class 130 and 155 available, all of them are in mass production.We are specialized in ultra fine enameled copper wire for 16 years, our wire range start from 0.012mm, we may be the only one can provide so thin wire im mass production in alibaba.
FEATURES
Temperature Rate: 130/155/180
Great consistency: 0 pinhole, no quality issue for long time storage
Excellant winding quality:Higher elongation, seldom broken during high speed winding
Marvelous breakdown voltage uniform coating, 3-6times than standard
Size range:start from 0.012mm
SPECIFICATION
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Characteristics |
Technical requests |
Test Results |
Conclusion |
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Sample 1 |
Sample 2 |
Sample 3 |
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1 |
Surface |
Good |
OK |
OK |
OK |
OK |
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2 |
Bare Wire Diameter |
0.020± |
0.001 |
0.020 |
0.020 |
0.020 |
OK |
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0.001 |
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3 |
Coating Thickness |
≥0.004 |
0.0060 |
0.0050 |
0.0050 |
OK |
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4 |
Overall Diameter |
≤0.027 |
0.0260 |
0.0250 |
0.0250 |
OK |
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5 |
Conductor Resistance |
≤60.810Ω/m |
56.157 |
56.148 |
56.182 |
OK |
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6 |
Elongation |
≥7% |
9% |
10% |
10% |
OK |
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7 |
Breakdown Voltage |
≥250V |
596 |
536 |
523 |
OK |
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8 |
Pinhole Test |
≤ 5 holes/5m |
0 |
0 |
0 |
OK |
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Remark: |
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Test Items |
Technical Requests |
Results |
Conclusion: Approved |
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1 |
Adhesive |
Coating layer is good |
OK |
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2 |
Cut-through |
230℃ 2mins no breakdown |
OK |
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3 |
Heat Shock |
200±5℃/30min no crack |
OK |
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4 |
Solder Ability |
390± 5℃ 2 Sec Smooth |
OK |
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5 |
Solvent Resistance |
No blister, no expansion, no shed |
OK | |||||||||
